| 摘要 |
PURPOSE:To turn the cut surfaces of filaments inside the end surface of the sealing body, by a method wherein filaments are cut at the small cross-section by tensile force after a lead frame is molded so that the small cross-section of filaments may be located inside the sealing resin. CONSTITUTION:A supporting plate 3 with a soldered semiconductor chip 2 and part of the lead frame 1, including the supporting plate 3, which has outer leads 5, 6, and 7 and filaments 12 and 13 are sealed with a resin 15. The filaments 12 and 13 are provided with small cross-sections 17 and 18 respectively at required distances inside away from the end surface 16 of the sealing resin 15, which cross-sections 17 and 18 are cut at the smallest cross-sections 17a and 18a by tension. The end surface 25 of the filaments 12 and 13 is recessed inside the end surface 16 of the resin by a length l1; then, a hole 24 is formed. Therefore, the creeping distance from the filaments 12 and 13 to an external heat dissipator 26 becomes longer: l1+l2, and insulation failure is prevented. |
