Verfahren zur Herstellung von elektronischen Bauelementen zur Ausübung des Verfahrens dienende Haltevorrichtung für Halbleitertabletten und nach dem Verfahren hergestelltes Bauelement

摘要

The semiconductor wafers for a rectifier circuit of the type wherein the conductors are formed from a single sheet of conductive material and shaped so that wafers may be inserted therebetween, are all simultaneously inserted and held in place by means of a holding device or jig which then remains in the finished device. The holding device is a sheet or plate of synthetic material having perforations or openings corresponding to the desired locations of the wafers in circuit arrangement and having a thickness substantially equal to that of the wafers. The wafers are held or mounted in the perforations by static friction as a result of an elastic layer provided between the walls of the perforation and the edges of the wafer.