| 摘要 |
PURPOSE:To obtain the titled copper plating soln. having high stability, giving a plated film having superior mechanical properties such as elongation, and easy to treat when the soln. is discharged as waste liquor after use, by adding a stannate to a plating soln. contg. Cu ions, a complexing agent for Cu ions and a reducing agent for Cu ions. CONSTITUTION:A stannate such as sodium stannate is added to a plating soln. contg. Cu ions fed from copper sulfate or the like, a complexing agent for Cu ions such as EDTA, a reducing agent for Cu ions such as formaldehyde and a pH adjusting agent such as NaOH to obtain an electroless copper plating soln. having high stability and giving a plated copper film having superior mechanical properties such as elongation. The amount of the stannate added is >=about 0.005mol/l. When the copper plating soln. is discharged as waste liquor after use, BOD and COD of the waste liquor can be reduced easily. |
