发明名称 FORMING PROCESS OF SINGLE CRYSTAL SEMICONDUCTOR LAYER
摘要 PURPOSE:To single-crystal a polycrystalline silicon film on an insulating film, by empolying ion beams with a spot or line shape. CONSTITUTION:After a polycrystalline silicon layer 4 is formed, ion beams 5 of compound are implanted into the layer 4 in an opening 3. As a result, the layer 4 is made locally single crystal 45 using the semiconductor substrate 1 as seed crystal. Next, by moving the ion beams 5 toward the polycrystalline film region in the direction 6, a single crystalline silicon layer 45 is formed. The scanning speed of the ion beams in the direction 6 is comparatively slow on account of making the polycrystalline silicon layer 4 amorphous sufficiently, and is preferably about 1mm./sec.
申请公布号 JPS6155915(A) 申请公布日期 1986.03.20
申请号 JP19840177914 申请日期 1984.08.27
申请人 NEC CORP 发明人 HOKARI YASUAKI
分类号 H01L21/20;H01L21/263 主分类号 H01L21/20
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