| 摘要 |
A process is described for soldering the above metals and their alloys. In the direct soldering of these materials using a conventional tin-lead solder, on account of the direct contact galvanic corrosion occurs on the contact surface which lifts the join between the solder and the substrate to be soldered. This galvanic corrosion can be avoided by first of all galvanising the substrate to be soldered with a layer of a nickel-copper alloy, and only then soldering the substrate, galvanised in this way, with tin-lead solder and conventional fluxes.
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