发明名称 PELLETIZING DEVICE OF SEMICONDUCTOR WAFER
摘要 <p>PURPOSE:To enable the high-efficiency and stable-quality production by processing the steps of application of wafer to a sheet to breaking and expansion of the sheet continuously and by automatic operation. CONSTITUTION:The sheet fed by a supply part 3 is separated into an addhesive sheet 1 and a protective sheet 2. A wafer 5 is sent to a positioning part 6 and is inserted between the sheets 1 and 2 to be brought in tight contact with the sheets 1 and 2 compulsorily by a roller 7. After that, the division into pellets is made by X and Y-rollers 9 in a breaking part 8 and the sheet 2 is wound into a containing part 10. Next, when the wafer 5 is sent to an expanding part 11, caps 13 of different diameter are inserted from a cap supply part 12 at the same time. Then the sheet is expanded by engaging two caps 13 and the intervals among the pellets present on the sheet are extended. Further, the periphery of the sheet which is attached to the caps 13 is cut. The caps 13 are contained in a cap containing part 14 and the sheet 1 is wound into an addhesive sheet containing part 15.</p>
申请公布号 JPS6155940(A) 申请公布日期 1986.03.20
申请号 JP19840178036 申请日期 1984.08.27
申请人 NEC CORP 发明人 OKAMURA MINORU
分类号 H01L21/301;H01L21/78 主分类号 H01L21/301
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