| 摘要 |
PURPOSE:To apply predetermined potential to a substrate for a semiconductor pellet by bonding the semiconductor pellet and a tape under the state in which a conductor enabling an ohmic contact is preset onto the back of the semiconductor pellet. CONSTITUTION:Lead nose sections 1a in lead frames 1 are bonded with an adhesive tape 2 so as to be arranged toward a space section 5. A conductor 3 for applying potential to the back side of a semiconductor pellet 4 is also formed onto the adhesive tape 2. The semiconductor pellet 4 is fixed to the conductor 3 and the adhesive tape 2 through conductive adhesives 5. The lead nose sections 1a and electrodes for the semiconductor pellet 4 are connected by bonding wires 7, and lead nose sections 1b and the conductor 3 are also connected by bonding wires 7. The whole is molded with a molding resin 8. |
