发明名称 |
PROCESS FOR MAKING ENCAPSULATED CIRCUIT BOARDS AND PRODUCTS MADE THEREBY |
摘要 |
A process is described for fabricating an encapsulated circuit board. The process involves use of an adhesive which is photochemically curable to a limited preselected depth so as to rigidly fix the circuit wires in X and Y directions while permitting limited pliability of the adhesive and hence mobility of the wires in the Z direction. The adhesive preferably is one which is also thermally curable so that at a later stage of fabrication (e.g., either as a part of or after lamination of individual circuit boards into a multilayered circuit board), the complete unit may be thermally bulk cured to rigidly fix all wires in the Z direction. |
申请公布号 |
DE3362072(D1) |
申请公布日期 |
1986.03.20 |
申请号 |
DE19833362072 |
申请日期 |
1983.05.25 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
GRANT, BARBARA, DIANNE;JONES, CAROL RUTH |
分类号 |
H05K3/46;H05K3/10;H05K3/38;H05K7/06;(IPC1-7):H05K7/06 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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