Process for electrochemical metallization of dielectrics

摘要

PCT No. PCT/SU80/00063 Sec. 371 Date Feb. 18, 1981 Sec. 102(e) Date Feb. 18, 1981 PCT Filed Apr. 25, 1980 PCT Pub. No. WO80/02570 PCT Pub. Date Nov. 27, 1980.A solution for electrochemical metallization of dielectrics comprising a salt of copper, a phosphorus-containing salt, a stabilizing agent and water which contains, as the phosphorus-containing salt, a salt of hypophosphorous acid, the components being employed in the following proportions, g/l: copper salt: 35 to 350 hypophosphorous acid salt: 35 to 400 stabilizing agent: 0.004 to 250 water: up to 1 liter. A process for electrochemical metallization of dielectrics involving preparation of the dielectric surface, formation of a current-conducting layer thereon, electrochemical building-up of a metal coating, characterized in that the dielectric surface activation and formation of a current-conducting layer on this surface are effected simultaneously by wetting the dielectric surface with the above-specified solution, followed by a heat-treatment at a temperature within the range of from 80 DEG to 350 DEG C.