发明名称 Apparatus for preheating mold resin for a semiconductor device
摘要 Preheating apparatus for use in a semiconductor molding apparatus for preheating mold resin before the mold resin is charged in a mold comprises a microwave generator generating a microwave, a waveguide connected to the microwave generator, and a positioning device for positioning the mold resin in such a manner that the center of the mold resin coincides with the position of a peak of the distribution of the electric field intensity due to the microwave.
申请公布号 US4577078(A) 申请公布日期 1986.03.18
申请号 US19840615463 申请日期 1984.05.30
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 NODA, YASUMASA;SUZUKI, YOICHI
分类号 B29B13/02;B29C45/46;H05B6/80;(IPC1-7):H05B6/64 主分类号 B29B13/02
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