发明名称 |
Apparatus for preheating mold resin for a semiconductor device |
摘要 |
Preheating apparatus for use in a semiconductor molding apparatus for preheating mold resin before the mold resin is charged in a mold comprises a microwave generator generating a microwave, a waveguide connected to the microwave generator, and a positioning device for positioning the mold resin in such a manner that the center of the mold resin coincides with the position of a peak of the distribution of the electric field intensity due to the microwave.
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申请公布号 |
US4577078(A) |
申请公布日期 |
1986.03.18 |
申请号 |
US19840615463 |
申请日期 |
1984.05.30 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
NODA, YASUMASA;SUZUKI, YOICHI |
分类号 |
B29B13/02;B29C45/46;H05B6/80;(IPC1-7):H05B6/64 |
主分类号 |
B29B13/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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