发明名称 LIQUID COOLING DEVICE
摘要 PURPOSE:To contrive to improve the cooling efficiency, by the liquid of low boiling point beint put in a cooling liquid and is made to circulate, and foam being generated in the cooling liquid is condensed effectively and eliminated. CONSTITUTION:A circuit substrate 4 mounted with LSI3 is immersed in fluorocarbon (boiling point 50 deg.C) 2. A pipe 5 which has a part weaving horizontally near the substrate 4 is provided and is made to pass also in the cooling water 6 above a vessel 1. Furthermore, fluorocarbon (boiling point 30-40 deg.C) 8 which cools the cooling liquid 2 in the pipe 5 is filled. The cooling liquid 2 boils by the operation of LSIs and bubbles 9 are generated and take heat away, and the cooling liquid 8 boils by taking heat of the cooling liquid 2, and a convection is generated in the determined direction by a valve 7 of in the pipe 5, and the cooling liquid 8 circulates in the pipe 5 and is condensed and cooled by the cooling water 6. Besides, water 6 is circulated and contributes to improve the cooling efficiency.
申请公布号 JPS6154654(A) 申请公布日期 1986.03.18
申请号 JP19840176708 申请日期 1984.08.27
申请人 FUJITSU LTD 发明人 YOKOUCHI KISHIO
分类号 H05K7/20;H01L23/427;H01L23/44 主分类号 H05K7/20
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