| 摘要 |
The present invention is directed to a hermetically sealed package adapted to form an enclosure for a semiconductor device. The package comprises a substrate with a refractory oxide layer on one surface and a metallized band on the refractory oxide layer. A metal cover is disposed on the substrate and sealed to the metallized band. A lead frame disposed between the substrate and cover comprises a plurality of lead elements which extend into the enclosure to be electrically connected to the semiconductor device. The lead frame has a refractory oxide layer on its surface to electrically insulate the lead frame from both the substrate and the cover. The lead frame also has a metallized band on its refractory oxide layer. A solder component bonds the cover onto the substrate with the lead frame extending therebetween so that the electronic device is sealed within the closure.
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