Method and apparatus for exposing photoresist by using an electron beam and controlling its voltage and charge

摘要

A method and apparatus are disclosed for exposing photoresist using an incident electron beam during the fabrication of a semiconductor device. The method includes the steps of coating the substrate with a photoresist that is exposed in response to an electron beam. An electron beam is projected onto the photoresist and deflected to trace a pattern. The voltage and the amount of charge of the electron beam are controlled as it is deflected so that the energy incident upon the coated photoresist is correlated to variations in the photoresist thickness to expose the photoresist with minimal penetration therethrough to underlying structures.