发明名称 METAL WIRING OF SEMICONDUCTOR DEVICE
摘要 PURPOSE:To weaken stress generated in the wiring itself and prevent disconnection by stress by setting length of straight part of wiring to 500mum or less in case the width is 3mum or less and providing a stress alleviating part. CONSTITUTION:Width of aluminum wirings 1A, 1B is 3mum or less and the electrode portions 2A, 2B being in contact with the predetermined region of semiconductor substrate are connected to a bus 3. In case distance of such electrodes 2A, 2B is 500mum or longer, the extending portions 4A, 4D are provided at the regions where the distance becomes 500mum or less. The width of such extending portions 4A-4D are 5mum or wider and length is 5mum or longer, and these are formed when the wirings 1A, 1B are formed. This extending portions 4A-4D weakens stress generated in the wirings 1A, 1B and disconnection of wirings 1A, 1B due to the stress can be prevented.
申请公布号 JPS6153743(A) 申请公布日期 1986.03.17
申请号 JP19840174011 申请日期 1984.08.23
申请人 FUJITSU LTD 发明人 KURAHASHI TOSHIO;KASHIWAGI SHIGEO
分类号 H01L21/3205;H01L21/82;H01L23/52;H01L23/522 主分类号 H01L21/3205
代理机构 代理人
主权项
地址