| 摘要 |
<p>PURPOSE:To eliminate damage and mark of pressure which may be given on the surface of wafer due to the existence of wafer dusts, etc. by forming a buffer belt having wool fiber to the surface which is in contact with the wafer surface. CONSTITUTION:When dicing a wafer 1 with a semiconductor wafer dicing apparatus, a buffer belt 10 having fine wool fiber is provided between the contact surfaces in the side of surface of wafer 1 and an elastic plate 6. In case this wafer 1 is diced into small sections, it receives a pressure of curves surface body 7, the wafer layer 8 sinks into the buffer belt 10 and thereby it can be prevented that damage and marks of pressure is generated on the surface of chip diced by the curved surface body 7. The wafer 1 can be diced without generation of damage and mark of pressure and a high quality semiconductor chip can be produced on the mass production basis.</p> |
