发明名称 SEMICONDUCTOR LEAD FRAME
摘要 PURPOSE:To prevent disconnection of wire and prevent generation of void in the sealing process by connecting islands to the external end of lead frame with many pin suspending portions. CONSTITUTION:An island portion 1 which mounts elements, an inner lead portion 5 having the wire boding portion and an outer lead 6 having external terminals are continuously provided with the external end of lead frame 2 and tie- bar 4. Two island suspending pins 3 connect the island portion 1 and the external end of lead frame 2. In this case, since the island portions 1 are connected symmetrically in the right and left to the end portion 2 or tie-bar 4, if the frame is waved, the stepped portion between the island 1 and leads 5, 5' is only a little and therefore wire disconnection is not generated. Moreover, since this lead frame is capable of providing wider gate, generation of void at the sealing process can be prevented.
申请公布号 JPS6153753(A) 申请公布日期 1986.03.17
申请号 JP19840175468 申请日期 1984.08.23
申请人 NEC CORP 发明人 SEI MASAHITO
分类号 H01L23/50;H01L23/495 主分类号 H01L23/50
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