| 摘要 |
PURPOSE:To form a high quality thermal head having no concentration irregularity caused by a conductor resistance body by bonding a copper foil with a conductive paste at a common connection sectin of an electrode body after forming an Al thin film electrode body to which a resistance body row is connected. CONSTITUTION:A resistance body film made of tantalum silicon TaSi is formed with a thickness of 0.3mum by a sputtering method on an alumina substrate 1 to which a garret 2 is formed, a conductor film of Al with a thickness of 2mum is formed by a vacuum deposition method, and a puttern is formed on a resistance body row 3 and on the electrode body row 4-1, 4-2 by a photographic etching method, respectively. Successively an abrasion resistance coating of tantalum pentaoxide Ta2O5 is formed in a thickness of 5mum by the sputter method using a mask together, and it is made as an abrasion resistance layer 5. Then, an electric conductive paste 7-1 is printed on a common connection section of the electrode body, and a copper foil 8 of a thickness of 100mum, a breadth of 3mm. is mounted closely. Successively, the electric conductive paste is dried at a temperature of 150 deg.C and cured, then, after an insulation resin is formed, it is dried and made into a protection layer. |
