| 摘要 |
PURPOSE:To automate filling of solder in a pin pot and to improve the quality of joining by giving vibration to one of solder iron tip or a pin having a minute hole, and continuing vibration during heating. CONSTITUTION:A heated soldering iron 13 is lowered to a pin 12 having a pin pot 11, and the pin 12 is preheated through the contact part of the top of the pin and the tip of soldering iron 13. Then, solder 14 is fed to the contact part, and molten solder 16 is formed at the tip of soldering iron 13. Thereafter, the pin 12 is vibrated vertically or horizontally to promote flowing down of the molten solder 16. After-heating is made while continuing vibration further. Consequently, bubbles 19 are floated up rapidly, and at the same time, the molten solder 16 is supplied surely to the bottom of the pin pot, and a molten solder pool 20 is formed on the bottom. Cooling is made successively to make the solder pool 20 solidified solder, and soldering of the pin pot 11 is completed. |
