发明名称 FORMATION OF OXIDE FILM FOR ISOLATING ELEMENT OF SEMICONDUCTOR DEVICE
摘要 PURPOSE:To reduce bird beaks and bird heads by applying a scratch by implanting high density ions to a region to be selectively oxidized and oxidizing at low temperature, thereby utilizing accelerating oxidation phenomenon. CONSTITUTION:A silicon oxide film 2 and a silicon nitride film 3 are sequentially formed on a silicon substrate 1, a hole 4 is formed at the film 3, and ions are implanted. The impurity 9 to be implanted is optimally argon of inert gas in the substrate 1 by applying scratch to the substrate 1 efficiently. Higher ion implanting density is effective. High pressure oxidation in steam is performed at low temperature of 900 deg.C or lower to obtain a separate oxide film 10. If performed at high temperature of 900 deg.C or higher, the scratch is annealed during the oxidation to reduce the accelerating oxidation effect. The suppressing effect of bird beak or bird head is remarkably exhibited at lower temperature of approx. 800 deg.C.
申请公布号 JPS6151843(A) 申请公布日期 1986.03.14
申请号 JP19840175582 申请日期 1984.08.21
申请人 MITSUBISHI ELECTRIC CORP 发明人 MASUDA MASAYUKI
分类号 H01L21/76;H01L21/316;H01L21/762 主分类号 H01L21/76
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