| 摘要 |
PURPOSE:To increase damp-proof and improve long term reliability of a semiconductor device, by employing filler with a larger specific gravity than that of sealing resin, being contained in sealing resin composite, and by rotating fast a resin forming mold to move the filler away from the wiring surface of the semiconductor device. CONSTITUTION:A semiconductor device including a semiconductor element 1 is fixed in a resin forming mold 11. Resin composite consisting of epoxy resin 8 and filler 9 with a larger specific gravity than that of the epoxy resin 8 is sealed in the mold 11. The mold 11 is fast rotated by ''0'' point as a center with the wiring surface of the semiconductor element 1 directed outwardly of the revolution. Since the filler 9 in the epoxy resin 8 being under a melting state is moved away from the passivation film 7, it can be prevented that the filler 9 may pass through the passivation film 7 and reach the aluminium wiring 4. |
