| 摘要 |
In order to tin the goldplated areas of electronic components, the component is dipped in a tin/lead bath for dissolving the gold, the component is centrifuged when leaving the dissolving bath 34 in order to throw off the tin/lead which is loaded with gold retained by the areas and, finally, the areas are tinned. The tinning may be carried out by immersion. The method may be implemented on a machine comprising an assembly 14 which can move in translation on horizontal shafts 12, which assembly comprises a rod 42 for holding the components by suction, which rod is associated with motors 56, 50 for driving it in rotation and vertical displacement. <IMAGE>
|
