| 摘要 |
PURPOSE:To obtain the titled device using a lead frame adaptable to the appliable chip size, by a method wherein an insulator is used as the island and fixed to the back of each lead stitch. CONSTITUTION:A plurality of leads 3 are formed by etching or punching a piece of metallic plate but provided with no islands for elements 1. Instead, the insulator (e.g. film) 6 which enables lead terminals to be fixed at the same time is adhered to the back the stitch of each lead 3. The semiconductor chip 1 is mounted on the insulator 6. This manner unnecessitates the production of various kinds of lead frames at the same time with changes in size of the chip or pellet 1 and also eliminates the variability of lead frames on account of the increase in degree of freedom in chip size selection. |
