| 摘要 |
PURPOSE:To improve damp-proofing, and to enhance reliability for a prolonged term by forming a protective film onto a passivation film by a thermal soluble substance having the melting point higher than a thermo-setting resin composition for sealing. CONSTITUTION:A protective film 11 consisting of a thermal soluble substance having the melting point higher than an epoxy resin 8 in a resin composition composed of the epoxy resin 8 and fillers 9 is shaped onto a passivation film 7. The protective film 11 does not melt even under the state of the melting of the epoxy resin 8 on sealing, and the acute angle sections of fillers 9 do not punch through both the protective film 11 and the passivation film 7 and do not reach up to an aluminum wiring 4 or a smooth coating film 10 on a semiconductor element 1 even when the acute angle sections of fillers 9 pierce through the protective film 11 by pressure on a resin seal. |
