CONNECTING PROCESS OF INTEGRATED CIRCUIT

摘要

PURPOSE:To improve dicing process and chip connecting process remarkably by a method wherein anisotropically conductive adhesive layer is provided on the surface of semiconductor wafer to be diced together with the wafer into chips and then bonded and fixed on a circuit substrate. CONSTITUTION:A wafer 1 with adhesive layer 2 is fixed on a fixing sheet 3 and then the wafer 1 is cut downward by a dicing saw into chips. Through these procedures, when a chip 5 and a substrate circuit 9 are face-down bonded, multiple fine electrodes 6 may be conductively connected to connecting terminals of substrate circuit 9 since the adhesive layer 2 containing conductive particles 7 is conductive in the thickness direction only and insulating in the surface direction while provided with high reliability upon electric and mechanical connection due to surface connection made feasible.