| 摘要 |
PURPOSE:To prevent the metal of the wiring on the surface of the EPROM semiconductor chip from being corroded and from disconnecting due to water content, corrosive ions and so forth by a method wherein a second resin is filled on the periphery of the EPROM semiconductor chip, which is mounted in the hollow plastic type backage, and on parts of the mounting part thereof, and at the same time, the upper part of the chip is sealed with an ultraviolet transmitting cover member. CONSTITUTION:A silicone resin 25, which is used as the first resin, is filled on the periphery of an EPROM semiconductor chip 22, which is placed in a hollow plastic type package 10, and an ultraviolet transmitting resin 28, which is used as the second resin, is filled in the gap between the EPROM semiconductor chip 22 and an ultraviolet transmitting cover member 27. By this way, the aluminum electrode for outside connection on the surface of the EPROM semiconductor chip 22 can be prevented from being corroded due to water content and corrosive ions, which intrude into from interfaces 26. |
