| 摘要 |
PURPOSE:To enable to lead out a bonding-wire from each bonding pad on both sides of the column of the bonding pad in the titled device, wherein plural pieces of bonding pads are arranged on the semiconductor substrate in one column or plural columns, by a method wherein the other bonding pads are provided in such a way as not to be provided at any position in the direction vertical to the direction of the column. CONSTITUTION:Bonding pads 61-66 and bonding pads 67-72 are arranged on a semiconductor substrate 51 in two columns. Assuming that the line to pass through each center of the bonding pads 61-66 in the column on one side is an X1 axis, the bonding pads 67-72 in the column on the other side respectively deviate from any position on Y1-Y6 axes to extend vertically from each center of the bonding pads 61-66 to the X1 axis. By this constitution, a bonding-wire can be led out from each bonding pad 61-72 even on either of both sides in the direction of the column of the bonding pad. As a result, a contact trouble that a bonding-wire, which is led out from a bonding pad, comes into contact to the other bonding pads can be prevented. |
