| 摘要 |
PURPOSE:To offer hybrid integrated circuit substrates, which are superior in productivity and reliability, by a method wherein a press blade is pressingly contacted to parts, from where a metal plate is divided into plural pieces, V- shaped slits are formed, and at the same time, an insulating layer is made to remain on the slant face of each slit. CONSTITUTION:An insulating sheet layer 2 and a copper foil are laminated in order on an aluminum metal plate 1 and the prescribed copper foil patterns 3 are formed by performing an etching. Then, a press blade is pressingly contacted in the directions shown by arrows and V-shaped slits 7, from where the metal plate 1 can be divided into plural pieces, are formed, and at the same time, the insulating sheet layer 2 is left on each V-shaped slant face 1a. The metal plate 1 is bent at the lower part of each slit 7 and are cut and the hybrid integrated circuit substrates are made. |
