发明名称 LEAD BONDING DEVICE
摘要 PURPOSE:To stably bond by inserting the leads of adhesive coating into the hole of a strand while rotating the strand of a core or the like. CONSTITUTION:Leads 2 are secured by chucks 6, 7, an adhesive 1 is coated, and the leads 2 are inserted to the midway of the hole of a core 3 rotatably driven by a rotating roller 4. After inserted to the prescribed position, chucks are opened and moved backward. According to this method, an adhesive can be uniformly coated on the core and the bonding portions of the leads to improve the reliability of bonding.
申请公布号 JPS6149409(A) 申请公布日期 1986.03.11
申请号 JP19840171158 申请日期 1984.08.17
申请人 NIPPON FERRITE LTD 发明人 ANDO HIROSHI
分类号 H01F41/04;H01F17/06;H01F41/10 主分类号 H01F41/04
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