| 摘要 |
PURPOSE:To reduce man-hours on assembly, and to extract performance original to an element by fixing a circuit substrate, to which a through-hole is bored, onto a heat-dissipating body and bonding and fastening the semiconductor element onto the surface of the heat-dissipating body exposed on the bottom of the through-hole. CONSTITUTION:A through-hole 3 is bored to a circuit substrate 1 on which a bonding circuit 2 for a conductive film is formed, and the substrate 1 is bonded with a heat-dissipating body 4. A semiconductor element 5 is bonded with the surface of the heat-dissipating body 4 exposed on the bottom of the through-hole 3 in the substrate 1, and the height of the element 5 and the height of the substrate 1 are brought to approximately the same size. Consequently, the substrate 1 need not be divided, and may be used in only one, thus attaining the reduction of man-hours on assembly. The element 5 can be connected to the conductive film in the substrate 1 and the heat-dissipating body at the shortest distance from an upper-surface electrode for the element 5, thus sufficiently extracting performance original to the element 5. |
