| 摘要 |
PURPOSE:To form a thin film without any break in a submicron region through making each incident angle predetermined angle by injecting most of particles from a supply source in the first and the second incident angles with a surface. CONSTITUTION:After a particle supply source generating adhering particles 24 and 25 of thin film forming material in a thin film forming device, these particies 24 and 25 are introduced and adhered to a surface of a thin film forming substrate 1 forming a thin film in a target 27. Most of particles 24 and 25 from this particles supply source are used to the surface of the substrate 1 as the first incident angle being an outside erosion region 22 and as the second incident angle being as an inside erosion region 23. This first incident angle is set at a sharper angle with a surface than the second incident angle, and the second incident angle is set at a sharper angle with a vertical direction of the surface than the first incident angle. After the first incident angle is set as about 15 deg. and the second incident angle is set at about 60-90 deg., a thin film is formed without any break in a submicron region. |
