| 摘要 |
PURPOSE:To attach leads to a semiconductor element in a high yield by providing lead group extending out of the end of the element on a substrate corresponding to the electrodes of the element, positioning them with the electrodes, pressurizing, heating and separating from the substrate and bonding to the electrodes. CONSTITUTION:Lead group 2 are provided on a glass substrate 1, projections 3 are formed on positions corresponding to the electrodes 6 of a semiconductor element 5, and extended at 4 out of the end of the element. The lead group 2 are formed of a material which can be readily alloyed with the electrodes 6 of the element 5 by plating or printing. The element 5 is attracted by a tool 7, the electrodes 5 are positioned with the projections 3, the tool 7 is then moved down to pressurize, heat and bond them. When the tool is then moved up, the lead group 2 is separated from the substrate 1, and the lead group are formed on the electrodes 6 of the element. According to this configuration, the circuit substrate is prevented from expanding or warping by the lead terminal completely to eliminate the improper connection and to obviate the decrease in the yield. |
