发明名称 Apparatus for forming bonding balls on bonding wires
摘要 There is disclosed an improved apparatus for forming a bonding ball on a tip end of the bonding wire. There are provided a capillary member having a through-hole for holding and guiding the bonding wire, and a cylindrical member having an inner diameter larger than the outer diameter of said capillary member and located in a substantially coaxial relation to the capillary member. The cylindrical member is adapted to be reciprocated in the same direction as that of movement of the capillary member but at a velocity slower than the moving velocity of said capillary member. Further, the cylindrical member is ceaselessly supplied with an inert gas. When the tip end of the bonding wire held by the capillary member is moved into the inside space of the cylindrical member because of the moving velocity difference between the capillary member and the cylindrical member in the upward stroke of the reciprocation of the two members, the tip end of the bonding wire is molten so as to form a bonding ball in the inert gas formed within the cylindrical member.
申请公布号 US4575602(A) 申请公布日期 1986.03.11
申请号 US19850726482 申请日期 1985.04.24
申请人 NEC CORPORATION 发明人 SAKURAI, KEIZOU
分类号 H01L21/60;B23K20/00;(IPC1-7):B23K31/00 主分类号 H01L21/60
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