发明名称 JET SOLDER TANK
摘要 PURPOSE:To prevent a solder from being oxidized, and to solder parts mounted with a high density, as well, by constituting a titled tank so that no vortex is generated on a molten solder liquid surface contacting to a driving shaft, and a wave and a flow of a molten solder in a jet port become the plural number. CONSTITUTION:Two plates 13 having a circular arc-shaped curve 14 in a part corresponding to a driving shaft 5 are placed relatively in a part contacting to a liquid surface of a molten solder 3 of a driving shaft 5 of a driving source 4. Accordingly, when a fan 6 has been rotated by the driving source 4, it is prevented by the plate 13 that the molten solder 3 becomes a vortex shape by the driving shaft 5, and the solder 3 is prevented from being oxidized. Also, a jet port 8 of a solder wave control plate 9 is constituted so that both ends become wide in width and the middle part becomes narrow in width. Accordingly, the molten solder 3 which flows through a passage 7 generates plural waveforms and flows of the solder running along A-A', B-B', C-C', D-D', E-E', and F-F'.
申请公布号 JPS6149769(A) 申请公布日期 1986.03.11
申请号 JP19840170609 申请日期 1984.08.16
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 HIRASE SHIGERU;YAMAZAKI NOBORU;MIZUTA ETSUYA
分类号 B23K1/08;B23K3/06;H05K3/34;(IPC1-7):B23K1/08 主分类号 B23K1/08
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