| 摘要 |
PURPOSE:To reduce the number of component parts needed as well as to cut down the manhours for assembling by a method wherein a rivet-like substance is passed through the penetrated holes of a semiconductor device and a radiator, and the semiconductor device is fixed to the radiator by crushing the tip of the rivet-like substance. CONSTITUTION:A rivet-like substance 7 is passed through the penetrated holes of a semiconductor device 1 and a dissipater 2. The rivet-like substance 7 is made of resin, and its thermal expansion coefficient is smaller than that of the dissipater 2. Then, the rivet-like substance 7 is crushed by heating while force is being applied to the semiconductor device 1 and the dissipater 2 in such a manner that they are tightly fixed. As a result, a part 8 which is heated up and crushed is formed, and the semiconductor device 1 is fixed to the dissipater 2. Also, the rivet-like substance 7 shrinks when it returns to the normal temperature, and this shrinkage generates the force with which the semiconductor device and the radiator 2 are tightly contacted. |
