| 摘要 |
PURPOSE:To reduce the thickness of the whole and attempt miniaturization by disposing printed pattern faces at both sides of an element having a printed pattern formed on its surface and constituting a circuit by use of a through hole disposed between the both pattern faces. CONSTITUTION:Elements 20 having connecting patterns 22 on their surfaces are mounted on a substrate 24 on which fixed printed patterns are provided. Through an insulating material 30 of ceramic and the like which is provided with apertures 28 having the thickness corresponding to that of the mounted elements 20 and allowing the upper face of each element to be exposed and at the same time, on which through holes 32 are provided at fixed positions, printed patterns 36 are disposed on the upper faces of the insulating material 30 and each element 20. A film 40 provided with the printed patterns 36 on its lower face and through holes 34 connected to the patterns 36 therein is mounted. Solder or conductive epoxy resin is cast into the through holes 40. |
