FORMATION OF CONDUCTOR LAYER ONTO RESIN

摘要

PURPOSE:To form a conductor layer having large adhesive force onto a resin with good productivity by forming a photosensitive resin layer on a substrate and exposing said layer through an exposing mask then making rugged the surface to form catalyst nuclei and subjecting the surface to electroless plating. CONSTITUTION:A polyimide resin 2 is coated on the alumina ceramic substrate 1 and is dried to cure; further a photosensitive polyimide precursor 3 is coated thereon and is dried. The precursor 3 is exposed to form light shielding parts 5 by using the exposing mask 4 distributed mixedly with the fine light transmitting parts and the fine light shielding parts 5 similar thereto. The substrate is dipped in a soln. mixture composed of N-methyl-2-pyrroline and methanol to remove the precursor of the parts not irradiated with the light in the exposing stage. The substrate is heated in nitrogen to convert the precursor 3 to polyimide and to form the rugged resin layer 6. The catalyst nuclei for the electroless plating are stuck onto the layer 6 and the substrate is dipped in an electroless plating bath to form a conductor layer 7 on the surface of the resin layers 2, 6.