| 摘要 |
PURPOSE:To contrive improvement in the dampproof property of the titled module by a method wherein the cracks generating on the interface between the casing of a hibrid IC module and its sealed resin by thermal effect are prevented. CONSTITUTION:An inner wall 2, rising from the bottom face and having a gap, opposing to the inner surface 1b of the side wall 1a of the casing 1 of a high brid IC module is provided on the hybrid IC module. Gel-formed resin such as silicon resin 106, for example, is sealed in the inner wall 2, and the inner face 1b of the side wall of the casing is sealed on the circumference of the inner face 1b of the side wall of the casing with the protective resin such as epoxy resin 107, which is filled in a gap passing over the inner wall 2 from the upper surface of the resin 106. |
