发明名称 ELECTRODE WIRING
摘要 PURPOSE:To prevent the generation of trouble, such as electromigration, resistance, creeping breaking and the partial fracture of an electrode wiring by forming the thickness of each layer in a monomolecular (or an atomic) layer or more and evaporating substances of two kinds or more in total in two layers or more. CONSTITUTION:A thernmal oxide SiO2 film 1 in thickness such as 0.5mum thickness is formed onto an Si substrate 2, and a Ta layer 3 in 5nm and an Al layer 4 in 100nm are evaporated onto the SiO2 film 1. The Al/Ta films are superposed and evaporated in nine layers, and a wiring in approximately 1mum width is processed. Crystal grains in an electrode wiring can be made small in such a wiring, thus displaying an effect of which defects, such as electromigration resistance, creeping breaking, the fracture of the wiring, etc. are reduced.
申请公布号 JPS6146048(A) 申请公布日期 1986.03.06
申请号 JP19840166357 申请日期 1984.08.10
申请人 HITACHI LTD 发明人 IWATA SEIICHI;HINODE KENJI
分类号 H01L23/52;H01L21/285;H01L21/3205;H01L23/532 主分类号 H01L23/52
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