发明名称 MANUFACTURE OF SEMICONDUCTOR DEVICE
摘要 PURPOSE:To obtain electrode wirings having low resistance and difficult to dissolve in medicines, by providing a nitride film of high fusion point metal on the surface of conductive film surface by heat treating conductive coating of high fusion metal or its silicide. CONSTITUTION:Ti2Si3 film 1 is treated in N2 by the spattering method for about 120sec at the 800-1,200 deg.C, and TiN2 film 2 of about 300Angstrom is made on the film 1. TiN2 is excellent for chemical-resistant property, and, for instance, there is no change even if it is treated in HF solution of 10:1 in 5min. The sheet resistance of this multiple is about 1.2OMEGA/square, and it is nearly the same with the sheet resistance of Ti2Si3 film. The same effect can be obtained by using Ta4Si5 or Ti, Ta besides Ti2Si3.
申请公布号 JPS6154648(A) 申请公布日期 1986.03.18
申请号 JP19840176911 申请日期 1984.08.24
申请人 MITSUBISHI ELECTRIC CORP 发明人 SHIMIZU MASAHIRO;OKAMOTO TATSURO;TSUKAMOTO KATSUHIRO
分类号 H01L21/3205;H01L23/52 主分类号 H01L21/3205
代理机构 代理人
主权项
地址