发明名称 Thyristor packaging system
摘要 A thyristor packaging system utilizes structured metal, strain buffers to provide paths of high electrical and thermal conductivity from the anode and cathode of a thyristor to power conductors connected to the anode and the cathode, such strain buffers each comprising a bundle of substantially parallel, closely packed strands of metal wire.
申请公布号 US4574299(A) 申请公布日期 1986.03.04
申请号 US19830540739 申请日期 1983.10.11
申请人 GENERAL ELECTRIC COMPANY 发明人 GLASCOCK, II, HOMER H.;NEUGEBAUER, CONSTANTINE A.;WEBSTER, HAROLD F.
分类号 H01L23/492;H01L25/07;(IPC1-7):H01H23/14 主分类号 H01L23/492
代理机构 代理人
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