发明名称 |
Thyristor packaging system |
摘要 |
A thyristor packaging system utilizes structured metal, strain buffers to provide paths of high electrical and thermal conductivity from the anode and cathode of a thyristor to power conductors connected to the anode and the cathode, such strain buffers each comprising a bundle of substantially parallel, closely packed strands of metal wire. |
申请公布号 |
US4574299(A) |
申请公布日期 |
1986.03.04 |
申请号 |
US19830540739 |
申请日期 |
1983.10.11 |
申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
GLASCOCK, II, HOMER H.;NEUGEBAUER, CONSTANTINE A.;WEBSTER, HAROLD F. |
分类号 |
H01L23/492;H01L25/07;(IPC1-7):H01H23/14 |
主分类号 |
H01L23/492 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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