| 摘要 |
PURPOSE:To prevent the generation of discharge between the exposed part of a heat dissipating plate and a heat radiator by a method wherein the tie-bar part remaining in a resin mold is separated off the heat sink part. CONSTITUTION:After a semiconductor pellet 5 is mounted and fixed on a lead frame 4 of an integral construction of a plurality of the lead part 1, heat sink part 2, and tie-bar part 3, the part 1 are electrically connected to electrodes. Next, resin molding 6 is carried out so as to surround the main part including the pellet 5 and the part 2, the projection out of the resin-molded section 6 of the part 3 is cut from above in the outer surface of the section 6 into discrete semiconductor devices. Then, a cut 8 is formed by cutting the part between the part 3 remaining in the mold 6 and the pellet mount into part of the section 6 on the back side of the part 2. This makes the potential of the part remain at zero or low potential. Therefore, discharge does not generate between the exposed section of the part 3 and the heat dissipating plate. |
