发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To effectively prevent any peeling or cracking at the junction of electrode with a pellet from happening by a method wherein the pellet is electrically connected to almost dumbbell type bump electrode formed of gold etc. CONSTITUTION:A pellet 4 is electrically connected to a dumbbell type bump electrode 5 made of gold etc. similar to the pellet 4 by means of soldering process. The electrode 5 is fixed by thermal pressure to an inner wiring 9 exposed to an opening of final passivation film 8 of the pellet 4. The narrow part 5a structurally benbable with excellent malleability due to gold material etc. may be easily deformed subject to no cracking etc. at all. Through these procedures, any peeling or cracking at the junction of electrode 5 with the pellet 4 or at the fixing part of electrode 5 to a wiring 2 on the substrate 1 may be effectively prevented from happening since any stress due to thermal expansion of the sub- strate 1 and the pellet 4 resultant from temperature cycle may be completely absorbed into the narrow part 5a.
申请公布号 JPS6143438(A) 申请公布日期 1986.03.03
申请号 JP19840164973 申请日期 1984.08.08
申请人 HITACHI LTD 发明人 KOSAKA HIDEKI
分类号 H01L21/60;H01L23/485 主分类号 H01L21/60
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