| 摘要 |
PURPOSE:To obtain efficiently a small-sized resin-sealed semiconductor device by a method wherein the terminal of the lead group arranged vertically and cylindrically on the surface of a chips is connected to the electrode terminals through wires, and the semiconductor chip and parts of the lead group are surrounded with a resin mold. CONSTITUTION:A semiconductor element, such as a transistor, is formed on the surface of the Si substrate of a semiconductor chip 1 and the electrode terminals 2 of the element are arranged on the main surface of the substrate along the peripheral edge part of the chip 1. Each lead plate 3 is one made by making round cylindrically a metal plate, which is formed like the teeth of a comb, the upper ends of the lead plates 3 are mutually coupled as a common frame 4 and the lower ends 5 thereof are rectangularly bent and are bond- ed to the central part of the chip 1. The lower part of each lead of the lead group 3 and each terminal 2 are connected using each metal wire 6. This formed body is installed between metal molds 9 and 10, each having a hole 12 and a hole 14, and a resin mold is formed. By cutting off the frame individually at the parts of the chip, where are exposing on the outer sides than the mold 7 of the lead group 3, the small-sized resin-sealed semiconductor device can be obtained. |
