| 摘要 |
<p>PURPOSE:To prevent a resin loss, irregularity in thickness and a warp, by a method wherein after a molding material has been sent into a pressure vessel under a state wherein the molding material is covered with a porous sheet and film and the inside of a film has been decompressed, molding is performed by pressing and heating the inside of the pressure vessel through gas. CONSTITUTION:A molding material 8 to be obtained by piling up a bed plate 12 having a hollow groove 15, a printed wiring board for an outside layer, an epoxy resin glass cloth prepreg and a printed wiring board for an inside layer on a plate material 13 in order is sent into the inside of a pressure vessel together with the plate material 13 and the circumference of the material 8 is decompressed by a vacuum pump. After the material 8 has been decompressed down to predetermined pressure, the material 8 is filled with gaseous materials such as N2, CO2 and the molding material 8 is pressed from the outside of a nylon film 16. After the same has been pressed and heated for a predetermined period of time, a molded multi-layer printed wiring board is obtained by performing cooling of the material 8 and releasing of the gas.</p> |
