发明名称 FILM FOR IC PROCESSING
摘要 <p>PURPOSE:To obtain the titled film from which the dust can be washed off and removed easily, by coating the surface of a synthetic resin film with an aqueous emulsion of a pressure-sensitive adhesive containing a water-soluble organic compound and a nonionic surfactant. CONSTITUTION:100pts.(wt.) of an aqueous emulsion of a pressure-sensitive adhesive (e.g. butyl acrylate) is mixed with preferably 5-50pts. of a water-soluble organic compound (e.g. triethylene glycol monomethyl ether) and/or 0.1-10pts. of a nonionic surfactant (e.g. polyoxyethylene nonylphenyl ether). The mixture is applied to a synthetic resin film (prefeably having a thickness of 5-500mum and subjected to the single-side corona treatment), and dried with hot air at 80- 150 deg.C to obtain the objective film. The thickness of the coating layer is preferably 1-200mum.</p>
申请公布号 JPS6143677(A) 申请公布日期 1986.03.03
申请号 JP19840164328 申请日期 1984.08.07
申请人 MITSUI TOATSU CHEM INC 发明人 NARIMATSU OSAMU;ITO MICHIYASU;KOMATSU KAZUYOSHI;SHIBATA YASUHIRO
分类号 C09J7/02;H01L21/301 主分类号 C09J7/02
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