| 摘要 |
PURPOSE:To obtain foam suitable for packing electronic parts, not being electrostatically charged with no adherence of dust, by blending a mixture of polyolefinic resin and carbon black with a polyoxyethylene higher fatty acid ester, subjecting the blend to expansion molding. CONSTITUTION:100pts.wt. raw material mixture comprising 10-30wt% carbon black and 90-70wt% polyolefinic resin is blended with 0.1-10pts.wt. polyoxyethylene higher fatty acid ester, and subjected to expansion molding. A resin selected from polyethylene, polypropylene, ethylene-vinyl acetate copolymer, and its mixture is used as the polyolefinic resin. An ester having 4-11 HLB value is used as the ester. |
