| 摘要 |
PURPOSE:To prevent cracks from production in sealing resin by a method wherein a supporting member, protruding from a sealed main body connected to an outer frame, is disconnected by a motion along the outer frame from the direction of the long side where there is no clamping. CONSTITUTION:The surface on a short side of a main body 5, which consists of a semiconductor IC1 mounted on a lead frame and is sealed in resin, facing the same of another main body 5 is fixed immovable by a clamp 14. A punch 13 is then inserted between an outer frame 7 and the main body 5. The punch 13 is caused to travel along the outer frame 7 to a location 8 whereat a suspension pin 6 is to be disconnected. The punch 13 abuts against a side of the suspension pin 6 for the disconnection of the suspension pin 6. The location 8 is determined by the thickness of the suspension pin 6, the cross section of the disconnected pin 6 is subject to the surface dimensions of the suspension pin 6, and a process of disconnection always demands the same force. A distance 15 between the location 8 of disconnection and the outer fringe of the long side of the main body 5 is long enough to ensure prevention of cracks from being produced in resin during the disconnecting process, which improves product quality. |
