| 摘要 |
A molding apparatus for sealing semiconductor chips in a resin, comprising a fixed upper mold section (106) and a movable lower mold section (113) which are opposed to each other. The movable lower mold section (113) is formed with a plurality of pots (114) extending therethrough, each pot having a plunger (115) intimately fitted therein from below at all times. The plungers (115) are adapted to be moved upwardly by cylinders (116) attached to a lower mold clamping platen (108), whereby the molding material pressed by the plungers is forced into the individual cavities under the same conditions only via culls and gates. <IMAGE> |
