发明名称 |
Tin-lead alloy plating bath. |
摘要 |
<p>A tin-lead alloy plating bath based on a principal plating bath comprising an alkanesulfonic or alkanolsulfonic acid and both bivalent tin and lead salts thereof is characterized by the addition of a guanamine compound having the general formula <CHEM> wherein R1 and R2, which may be the same or different, present each a hydrogen atom, C1-18 straight- or branched-chain alkyl radical, C1-18 straight- or branched-chain alkoxy-lower alkyl radical, or a C3-7 cycloalkyl radical, or R1 and R2 may combine to form a carbon cycle or hetero cycle, and A represents a lower alkylene radical.</p> |
申请公布号 |
EP0172267(A1) |
申请公布日期 |
1986.02.26 |
申请号 |
EP19840109981 |
申请日期 |
1984.08.22 |
申请人 |
OBATA, KEIGO;DOHI, NOBUYASU;DAIWA FINE CHEMICALS CO., LTD.;ISHIHARA CHEMICAL CO., LTD. |
发明人 |
OBATA, KEIGO;DOHI, NOBUYASU;OKUHAMA, YOSHIAKI;MASAKI, SEISHI;OKADA, YUKIYOSHI;YOSHIDA, TADASHI |
分类号 |
C25D3/60;H05K3/34;(IPC1-7):C25D3/60 |
主分类号 |
C25D3/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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