发明名称 Tin-lead alloy plating bath.
摘要 <p>A tin-lead alloy plating bath based on a principal plating bath comprising an alkanesulfonic or alkanolsulfonic acid and both bivalent tin and lead salts thereof is characterized by the addition of a guanamine compound having the general formula &lt;CHEM&gt; wherein R1 and R2, which may be the same or different, present each a hydrogen atom, C1-18 straight- or branched-chain alkyl radical, C1-18 straight- or branched-chain alkoxy-lower alkyl radical, or a C3-7 cycloalkyl radical, or R1 and R2 may combine to form a carbon cycle or hetero cycle, and A represents a lower alkylene radical.</p>
申请公布号 EP0172267(A1) 申请公布日期 1986.02.26
申请号 EP19840109981 申请日期 1984.08.22
申请人 OBATA, KEIGO;DOHI, NOBUYASU;DAIWA FINE CHEMICALS CO., LTD.;ISHIHARA CHEMICAL CO., LTD. 发明人 OBATA, KEIGO;DOHI, NOBUYASU;OKUHAMA, YOSHIAKI;MASAKI, SEISHI;OKADA, YUKIYOSHI;YOSHIDA, TADASHI
分类号 C25D3/60;H05K3/34;(IPC1-7):C25D3/60 主分类号 C25D3/60
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