| 摘要 |
A chip-type LC composite component in which an inductance element section (51) for producing an inductance component is superposed on a laminated capacitor section (34) for producing a capacitance component. Conductive paths (39, 40, 42, 43, 45, 46, 48, 49) included in the inductance element section (51) extend between outer electrodes (31, 33) of the laminated capacitor section (34). The inductance element (51) includes a laminated substance comprising a plurality of layers (39, 41, 44, 47, 50) obtained by firing paste containing powder of sintered ferrite, glass frit and organic binder and solidifying the same. The conductive paths (39, 40, 42, 43, 45, 46, 48, 49) included in the inductance element section (51) include conductive patterns formed on the respective layers of the laminated substance extending so as to produce an inductance component.
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